1. Solder Paste
Solder paste is a new type of soldering material that came along with SMT (Surface Mount Technology) in electronics . It is gray paste-like mixture formed by tin powder, solder flux, active surfactant, thixotropic and more agents. The solder paste has a certain viscosity at normal temperature to initially stick electronic components at a predetermined position. As the solvent and additives in the paste evaporate at the soldering temperature, the electronic components can be soldered with the printed circuit pad and form permanent connection. It is mainly used for the soldering of electronic components such as PCB surface resistance, capacitance, and IC in the SMT industry.
2. Paste Flux
Solder Paste Flux is a rosin chemical compound used mainly by manufacturer to combine with solder alloy powder and tin additives to create solder paste, generally mixed at a certain ratio for different electronic soldering requirements.
3. Solder Flux
Solder Flux, usually a mixture based on rosin, is an auxiliary material to ensure the smooth welding process in electronic assembly. Liquid and paste rosin fluxes are suitable for wave soldering. Rosin flux is an indispensable product for wave soldering to remove the rust, reduce the tension of liquid tin on the metal surface, transfer heat, and prevent the circuit board from re-oxidation during the heating of wave soldering.